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Memory
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Written by Metal Ghost - Administrator
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Thursday, 01 May 2008 12:32 |
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  Sunnyvale, CA—April 17, 2008—OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today unveiled a blazing fast DDR3 addition to the new Flex II memory series. These premium modules run at incredibly fast 2000MHz speeds at CL8-8-8 timings for added performance to high-end systems with integrated water-cooling. Designed to the very core to offer enthusiasts the thermal management innovation of hybrid water and passive cooling, the new PC3-16000 Flex II Series offers rock-solid stability and performance for your high-end gaming or overclocking system.
The OCZ Flex II heat management solution enables high-frequency memory to operate within an optimal balance of extreme speeds and low latencies without the high temperatures that inhibit or damage the module. Each PC3-16000 Flex II memory module features this breakthrough thermal management technology from OCZ that combines an effective new heatspreader design with integrated liquid injection system and dedicated channels directly over the module’s ICs to effectively dissipate heat produced by high-speed memory. This sophisticated series was engineered with a unique “flexible” design to give enthusiasts the option to run the modules passively or water cooled via the thick array of aluminum fins, and the concurrent use of both options promotes maximum heat dissipation.
“A data rate of 2GHz was unthinkable only a year ago,” commented Dr. Michael Schuette, VP of Technology Development at OCZ Technology. “Power consumption and heat generation directly follow the operating frequency; therefore, the thermal dissipation of these modules exceeds any specifications of the original design and requires the most advanced thermal solution that will reliably work under any conditions. Whether in a water-cooling environment or else under air-cooling conditions, the legacy of the Flex series continues with the Flex II design as the most advanced memory cooling solution for the fastest modules out there.” |
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Last Updated ( Sunday, 04 May 2008 09:10 )
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Written by Metal Ghost - Administrator
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Thursday, 01 May 2008 12:26 |
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  Kingston Technology Company, Inc., the independent world leader in memory products, today announced it is first to offer high performance, low-latency DDR2-667 SO-DIMM notebook memory to the world. Offering greater performance options for existing mobile platforms, the HyperX DDR2-667 CL4 SO-DIMM kits in 2GB and 4GB capacities are the first in a new line of memory innovations Kingston plans to release over the next few months to the notebook market.
“Kingston customers asked about higher performance memory for current notebooks and our new DDR2-667 CL4 low-latency SO-DIMMs are the first in a series of new HyperX memory offerings to support this market,” said Ann Bai, Product Manager, DRAM Memory, APAC Region, Kingston. “We will continue to expand the product line, including developing a 3GB memory kit.” |
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Last Updated ( Sunday, 04 May 2008 09:10 )
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Written by Metal Ghost - Administrator
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Friday, 08 February 2008 10:11 |
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Intel Corporation and Micron Technology unveiled a high speed NAND flash memory technology that can greatly enhance the access and transfer of data in devices that use silicon for storage. The new technology – developed jointly by Intel and Micron and manufactured by the companies’ NAND flash joint venture, IM Flash Technologies (IMFT) – is five times faster than conventional NAND, allowing data to be transferred in a fraction of the time for computing, video, photography and other computing applications. The new high speed NAND can reach speeds up to 200 megabytes per second (MB/s) for reading data and 100 MB/s for writing data, achieved by leveraging the new ONFI 2.0 specification and a four-plane architecture with higher clock speeds. In comparison, conventional single level cell NAND is limited to 40 MB/s for reading data and less than 20 MB/s for writing data. “Micron looks forward to unlocking the possibilities with high speed NAND,” said Frankie Roohparvar, Micron vice president of NAND development. “We are working with an ecosystem of key enablers and partners to build and optimize corresponding system technologies that take advantage of its improved performance capabilities. Micron is committed to NAND innovation and designing new features into the technology that create a powerful data storage solution for today’s most popular consumer electronic and computing devices.” “The computing market is embracing NAND-based solutions to accelerate system performance through the use of caching and solid-state drives,” said Pete Hazen, director of marketing, Intel NAND Products Group. “At up to five times the performance over conventional NAND, the high speed NAND from Intel and Micron, based on the ONFi 2.0 industry standard, will enable new embedded solutions and removable solutions that take advantage of high–performance system interfaces, including PCIe and upcoming standards such as USB 3.0.”
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Written by Metal Ghost - Administrator
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Wednesday, 16 January 2008 09:59 |
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The DDR3 has become more popular in the market since Intel’s introduction the P35 and X38 chipsets. After introducing the high-level DDR3-1333 module for desktops and the high-level DDR3-1333 SO-DIMM for laptops, TwinMOS would like to introduce the TwiSTER over-clocking series, which includes DDR3-1600 and DDR3-1800 models, to fulfill the hardware requirements of professional game players and overclockers. The TwiSTER series is the highest quality product line from TwinMOS, featuring reliable data access at ultrafast speeds. Every module is made with selected original dies and high-standard production processes. More importantly, every module is tested to comply with the published specifications, and quality is controlled according to the highest standards.
DDR3-1600MHz and DDR3-1800MHz memory modules of the TwiSTER series are made with the original dies from Micron Technology Inc in a 128Mx8 layout and are delivered in 1GB capacity. These dies are packaged with the latest FBGA (Fine-pitch Ball Grid Array) technology. Other specifications of these modules include 240-pin design, working voltage at 1.8V, CL= 8-8-8-21, clock frequency at 1600MHz and 1800MHz, and data transfer bandwidth at 12800MB/sec (DDR3-1600) and 14400MB/sec (DDR3-1800). Therefore, it is real good news to overclockers. The high-performance heat-sink equipped on the module provides perfect cooling and electrical characteristics to enhance the work efficiency of the module. The circuit design layout conforms completely to the JEDEC circuit specification to prevent noise interference in order to ensure multimedia operation stability at high speeds and the reliability of huge data storage for full compatibility to PCs.
TwinMOS provides global, lifelong warranties for all memory products. In addition to quality assurance, TwinMOS provides permanent warranty service with its global operations as a world leading memory supplier. Moreover, as TwinMOS has been a major memory module supplier for world leading system suppliers, to cope with the lead-free environmental process promoted internationally, all TwinMOS production lines comply with the RoHS environmental directive of the EU in order to make greater corporate contributions to a greener earth.
Key Features
* 8-bit pre-fetch design
* Ultra high frequency at 1600MHz(DDR3-1600)/1800MHz(DDR3-1800) with the 240-pin design
* Data transfer bandwidth at 12800MB/sec (DDR3-1600) and 14400MB/sec (DDR3-1800)
* Working voltage : 1.8V
* High compatibility and reliability
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Wednesday, 20 June 2007 09:51 |
  [[OCZ]] Technology Group, Inc., a worldwide leader in innovative ultra-high performance and high reliability memory, today announced the PC2-6400 Platinum Vista Performance Edition 4GB (2x2048MB) dual channel kit. These new modules feature enhanced timings and are the ultimate upgrade for gamers transitioning their high-performance systems to Windows® Vista™.
For enthusiasts shifting to Vista and who need the performance of high speed memory, the PC2-6400 Platinum 4GB kit is the ideal upgrade from the standard 2GB of RAM. The OCZ PC-6400 Vista Performance series was developed to provide a superior computing experience that ensures the best possible gaming and productivity on Vista systems.
As part of OCZ’s Platinum series, the PC2-6400 4GB modules are engineered to satisfy the demands of overclockers and enthusiasts and designed deliver the performance and speed gamers require for today’s graphic-intensive DirectX 10 PC games. At 800MHz, the 4GB Platinum Edition runs at blazing fast 5-4-4 timings and offers unprecedented bandwidth and stability on the latest platforms.
“Nothing enhances system performance as much as the amount of memory since the system memory is still the fastest storage medium in any personal computer,” commented Dr. Michael Schuette, VP of Technology Development at OCZ Technology. “High system memory densities become especially important for use with the latest platform generations utilizing PCI Express and other integrated peripherals such as network controllers since those components take away memory from the total system memory pool. More important is yet to make sure that memory performance is not sacrificed by going to high densities. That is where the new 4GB Platinum kits combine the best of two worlds—abundant memory with OCZ’s patent-pending Enhanced Bandwidth Technology to again raise the bar for memory products.”
The PC2-6400 Platinum Vista Performance Edition memory will be available in 2048MB (2GB) modules and 4GB dual channel kits. All modules are 100% hand-tested for quality assurance and compatibility and feature high quality, platinum-mirrored XTC (Xtreme Thermal Convection) heatspreaders for the most effective heat dissipation. Furthermore, each OCZ Platinum Edition memory module is backed by the industry leading OCZ Lifetime Warranty and technical support for unparalleled peace of mind.
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Last Updated ( Sunday, 24 June 2007 13:48 )
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Wednesday, 20 June 2007 09:44 |
  Kingston Technology Company, Inc., the independent world leader in memory products, today announced it is shipping HyperX 1375MHz and ValueRAM 1066MHz double-data-rate three synchronous dynamic random access memory (DDR3 SDRAM) modules—the cutting edge in memory technology. Hailed as the successor to the current DDR2 memory standard, DDR3 promises significant performance gains at lower voltage levels, resulting in lower overall power consumption. Additionally, Kingston will release ValueRAM 1333MHz DDR3 modules to coincide with X38 motherboards launching later this summer.
“Leading with our HyperX product line, Kingston is able to produce the fastest memory possible for enthusiast gamers, professionals and innovators,” said JK Tsai, director, Technology Resource Group, Kingston®. “Introducing revolutionary technology such as DDR3 to support the newest motherboards—our ValueRAM 1333MHz supports boards not yet on the market—and chipsets is a great accomplishment from our dedicated engineering team. Many motherboard companies have tested Kingston DDR3 memory in their labs and are very satisfied with the performance.”
“Kingston has been working closely with Asus, Gigabyte and other top motherboard manufacturers in our HyperX DDR3 testing process,” said Mark Tekunoff, senior technology manager, Kingston. “We successfully screened and yielded production quantities of DDR3 memory at 1375MHz, giving technology early adopters and gamers the opportunity to test-drive the newest motherboards at some of the highest performance levels available. Many motherboards shown at Computex 2007, based on the new P35 chipsets, now support DDR3 technology.”
DDR3 technology is expected to be twice as fast as today’s highest speed DDR2 memory and the greater bandwidth promised by DDR3 is a perfect match for systems using dual and quad core processors. The lower voltage of DDR3 (HyperX 1.7v versus 1.8v with DDR2 and ValueRAM 1.5v versus 1.8v with DDR2) provides a more efficient thermal solution for today’s desktop and future mobile and server platforms.
Kingston DDR3 modules are shipping in 512MB and 1GB capacities as well as 1- and 2GB memory kits. Kingston memory comes with a lifetime warranty and free technical support.
HyperX 1375MHz/ValueRAM 1066MHz DDR3 DIMM Features:
• DDR3-1375 CL7-7-7-20 @ 1.7v
• DDR3-1066 CL7-7-7-20 @ 1.5V
• CAS Latency: 7
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Last Updated ( Wednesday, 20 June 2007 19:31 )
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Wednesday, 20 June 2007 09:39 |
 Corsair® http://www.corsair.com, the worldwide leader in high performance computer and flash memory products, today unveiled the worlds fastest production DDR3 memory rated at a blazing-fast 1,600MHz (PC3-12,800) and the world preview of the Corsair DOMINATORTM memory running at 2,000MHz (PC3-16,000). Live demonstration of the new DOMINATOR memory will be on display in the Corsair VIP suite (#1334) at the Grand Hyatt Hotel. The TWIN3X2048-1600C10D DOMINATOR is the latest addition to the Corsair line of high-performance memory modules. Also on display is the upcoming generation of DDR3 DOMINATORs, ranging from 1GB modules running at over 2,000MHz and 2GB modules showing performance promise for 64-bit based applications. All DDR3 products have been developed to support the new Intel® P35 and X38 Express platforms, ensuring customers of an extreme user experience whether for gaming or applications with high computing needs.
The TWIN3X2048-1600C10D DOMINATOR will be available shortly after Computex. Both XMS3 DHX and XMS3 Classic products are currently available through Corsairs worldwide authorized dealer channel: | FAMILY | PART NUMBER | SPEED | LATENCIES | | DOMINATOR | TWIN3X2048-1600C10D | 1600MHz | 10-8-8-24 | | XMS3 DHX | TWIN3X2048-1333C9DHX | 1333MHz | 9-9-9-24 | | XMS3 CLASSIC | TWIN3X2048-1333C9 | 1333MHz | 9-9-9-24 | | | TWIN3X2048-1066C7 | 1066MHz | 7-7-7-21 | All DDR3 modules operate at lower memory voltages to deliver better performance with the same amount of power when compared to DDR2. Dynamic I/O Signal Termination and On-die Dynamic Termination (ODT) reduce the reflective signals transmitted to standby RAMs, thereby enabling support for higher memory frequencies. A larger prefetch means more data is immediately available for the processor and the differential data strobe reduces noise while accessing data, especially at higher frequencies.
Corsair is supporting the industrys transition to DDR3 with a full line of highly-engineered memory solutions. Our partnerships with leading technology companies and suppliers have allowed us to be first-to-market with the worlds fastest production DDR3 memory and demonstrating our next generation DOMINATOR running at 2GHz, said Jack Peterson, VP of Marketing at Corsair. DDR3 memory technology brings scalability and features that DDR2 cannot deliver. The fact that we are able to realize 50% more memory speed rating at launch compared to the standard DDR3-1066 specification is simply stunning. continued Peterson.
Like their DDR2 brethren, DDR3 DOMINATOR and XMS3 DHX feature Corsairs patent-pending DHX technology - an innovative quad-layer heat sink design that optimizes memory performance and reliability by maximizing thermal dissipation. With DHX Technology, heat is removed via two paths the leads of the BGA chips into the PCB (convective cooling) and the back of the BGA packages into the custom designed extruded aluminum heat sinks (conductive cooling).
The enthusiast community demands solutions that push the envelope and are capable of delivering the highest level performance experience, and very fast DDR3 is the next step in delivering cutting-edge computing, said Steve R. Peterson, Director of Chipset & Graphics Marketing, Intel. We work closely with Corsair to help deliver a cutting edge experience for the enthusiast power user. Corsairs release of the new DDR3-1600 DOMINATOR memory, combined with an Intel P35 or X38 Express chipset based motherboard, plus an Intel Extreme Edition CPU, shows just how exciting platforms based on DDR3 will be. |
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Last Updated ( Wednesday, 20 June 2007 19:31 )
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Tuesday, 19 June 2007 09:26 |
OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today announced their official crossover into DDR3 memory to coincide with the recent launch of the Intel Bearlake Chipset. OCZ’s hand-tested DDR3 solutions enable ardent enthusiasts to take advantage of the highly-anticipated P35 platform while experiencing the legendary quality and reliability of OCZ memory.
“For the past few years, we have highly anticipated DDR3, since it is everything DDR2 should have been from the very beginning,” commented Dr. Michael Schuette, VP of Technology Development at OCZ Technology. “Being part of the task group defining the serial presence detect and extended feature set of DDR3 has further increased our commitment to the third generation of double data rate memory and we are ready to break some new performance records.”
The first OCZ DDR3 products will accommodate standard JEDEC specifications for third generation DDR. OCZ is pleased pick up where their high-end DDR2 memory left off and offer Gold Series memory kits in PC3-8500 (1066MHz) and PC3-10666 (1333MHz) speed grades.
OCZ Gold DDR3 modules will be initially available in 2x512MB and 2x1024MB dual channel kits. These modules are currently available in limited quantity and OCZ has been working closely with the leading platform providers to ensure optimal performance and compatibility on all the next generation computing platforms that will be introduced later this year. Each module is 100% hand-tested for quality assurance and compatibility and feature proprietary gold-mirrored XTC (Xtreme Thermal Convection) heatspreaders for the most effective heat dissipation. As part of OCZ’s line-up of premium memory, the DDR3 series is backed by a Lifetime Warranty and industry-leading technical support for unparalleled peace of mind. |
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Tuesday, 05 June 2007 10:04 |
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that 21 of its DDR3 solutions have been validated on Intel Corporation's reference platform to work with Intel's next generation DDR3 (Double Data Rate – Version 3) chipsets. This is the largest number of DDR3-based solutions to have passed the validation program.
Samsung's Intel-validated solutions include 13 modules and eight monolithic devices in combinations of 512Megabit (Mb)/1Gigabit (Gb) densities with speeds of 800 or 1066Mb/ps.
“Samsung's DDR3 memory technology is the next step in the evolution of DDR SDRAM memory technology,” said Pete MacWilliams, Senior Fellow, Intel Corporation. “This technology will also provide the bandwidth headroom necessary to support Intel's platform roadmap of the future.”
Samsung has worked very closely with Intel to develop the most advanced and comprehensive set of DDR3 memory solutions as early as possible in preparation for the next generation of Intel chipsets.
“The successful system performance of Samsung's DDR3 memory chips and modules on Intel's desktop platform is a clear sign that DDR3 is well on its way to becoming a key technology for desktops in 2007,” said Kevin Lee, Vice President, Memory Marketing, Samsung Semiconductor, Inc.
Samsung Electronics will exhibit at Microsoft's WinHEC 2007 Conference on May 14-15 a high-performance desktop PC installed with 8GBs of memory, consisting of four 1333Mbps 2GB DDR3 memory modules. This 1333 Mbps 8GB configuration is currently the fastest speed and largest density for a DDR3 chip, making it the optimal memory solution for PCs with advanced gaming features.
DDR3 memory will provide at least twice the bandwidth of today's primary memory – DDR2 – with data transfer rates now up to 1.6Gb/s. This will enable much improved 3D graphics, which will directly benefit users of the new Vista operating system. DDR3 also improves the efficiency of multi-threading operations, which will enhance the performance of multi-core systems. DDR3 not only allows for higher system performance, but it also uses only 1.5V of power compared to the 1.8V of DDR2, thereby extending battery life in notebooks. To further optimize system thermal management, DDR3 modules can utilize a thermal sensor on the dual in-line memory module (DIMM).
With its new DDR components and modules, Samsung continues to lead the industry with cutting-edge DRAM technology after being the first to introduce DDR in 1997, DDR2 in 2001, and DDR3 in 2005.
To meet market demand in desktop PCs, Samsung plans to begin full-scale mass production of its DDR3 chips later this quarter. |
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Tuesday, 05 June 2007 10:02 |
OCZ Technology Group, Inc.a worldwide leader in innovative, ultra-high performance and high reliability memory, today announced the OCZ PC2-8500 AMD CrossFire™ Reaper HPC Edition. As some of the highest performing modules on the market, the PC2-8500 CrossFire features the exclusive OCZ CrossFire edition Reaper HPC heatsink for advanced component cooling.
Tested and qualified under AMD’s renowned certification program, the PC2-8500 CrossFire series not only meets a high standard of quality, but guarantees superior compatibly with CrossFire technology. Combined with AMD’s esteemed CrossFire technology, the OCZ PC2-8500 certified series unleashes the performance potential of the entire platform.
AMD enthusiasts and system builders will love the customized look of the new Reaper kits; these modules are cooled with an exclusive AMD special Reaper HPC (Heat Pipe Conduit) heatspreader displaying AMD’s “CrossFire Certified” emblem. These unique DDR2-1066 modules feature the Reaper HPC (Heat Pipe Conduit) heatspreader which is engineered to deliver superior silent heat dissipation over traditional heatspreaders. The Reaper HPC is an innovative cooling solution developed by OCZ to effectively minimize heat produced by high-speed memory. As heat rises into the thermo-conductive copper heat pipe conduit, it is dissipated through a compact aluminum fin array. By strategically guiding performance-robbing heat away from key memory components, the unique Reaper HPC design maximizes passive cooling to improve longevity and stability of the modules.
The first certified Reaper HPC memory product available will be 2GB (2x1024MB) dual channel kits optimized for the latest CrossFire platforms. Rated to run with 5-5-5 timings, these modules offer gamers an additional performance edge over conventional DDR2-1066 memory. The CrossFire Certified Reaper 2GB kit is the supreme solution for gamers seeking the advantages of increased reliability and bandwidth management from their memory. Each OCZ PC2-8500 CrossFire Reaper module is backed by an industry leading OCZ Lifetime Warranty and technical support for unparalleled peace of mind. |
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